Barely Significant

Excerpts

4,562 sentences · 1 filter applied

Newly developed lead-free alloy systems have been discovered that can successfully replace them [ 16 ], such as those in the binary Sn-Cu, Sn-Ag, Sn-Bi, Sn-Zn, Sn-In, and Sn-Sb systems or the ternary Sn-Zn-Bi and Sn-Ag-Cu systems (SAC solders), with acceptable properties (melting temperature, mechanical properties, microstructure, wettability, solder ability, reliability, and cost), thus offering a positive trend in terms of finding new variants of accessible lead-free soldering alloys with properties similar to those prohibited [ 6 , 7 , 8 , 9 , 10 , 11 , 13 ].
Although lower compared to some reports in the literature [ 43 , 68 , 74 , 75 , 76 , 77 ], which show compressive strength increases of 10% to 80%, depending on test age and NT content (1–4 wt.% NT), it can be said that the research results are in agreement with these reports, maintaining an increasing trend, and in contradiction with those indicated by Shekari and Razzaghi [ 60 ], who for a cementitious composite with 1.5% NTs report a reduction in compressive strength of 20.73% at the age of 28 days.